Micro-cracking occurs in nearly 100% of IC packages containing moisture during the Reflow process. This results in the corrosion of printed circuits for an extended period of time causing breakage of wiring and other problems. Micro-cracking can be prevented with storage and dehumidification of IC’s using McDry.
Some IC Packages are only guaranteed for 24 hours after they have been removed from moisture barrier bags (MBBS). Outside of the MBB, IC packages absorb moisture from the atmosphere which can result in micro-cracking during the Reflow process. To prevent micro-cracking, moisture containing IC’s can be baked or stored in McDry ultra-low humidity storage cabinets.
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